Benefits of GOB Technology
1. There are eight protections: anti-corrosion, dust-proof, waterproof, moisture-proof, anti-blue light, anti-salt, and anti-static.
2. The viewing angle is extended as a result of the frosted surface effect, which also boosts color contrast and realizes the conversion display from perspective light source to surface light source.
GOB Process
1.Material Slicing
The packaging materials used by GOB must be specially designed materials that are created in accordance with GOB's process plan and have the following qualities: 1. High adhesion;
2. robust pulling and vertical impact forces;
3. hardness;
4. high transparency;
5. resistance to temperature;
6. resistance to yellowing;
7. resistance to salt spray;
8. resistance to high wear;
9. antistatic;
10. resistance to high pressure; etc.
2.Filling
The packing material should be securely bonded to the PCB and fill all the gaps between the lamp beads as well as cover their surface throughout the filling GOB packaging process. No gaps, white patches, bubbles, pinholes, or bottom fillers should be present. On the PCB's bonding surface and adhesive.
3.Shedding of thickness
The glue layer thickness consistency, or more specifically, the consistency of the glue layer thickness over the lamp bead surface. Following GOB packing, it is necessary to guarantee the consistency of the adhesive layer thickness on the lamp bead's surface. Currently, the glue layer has nearly no thickness tolerance due to the complete update of the GOB process to version 4.0. There is no difference in the thickness tolerance between the original module and its final version. It may even lessen the original module's thickness tolerance. Perfect joint flatness is achieved!
4.Leveling
The GOB package's surface flatness must to be excellent, devoid of any lumps, waves, etc.
5.Shedding on the surface
GOB containers' exterior coating. Depending on the many features of the product, the surface treatment market is currently separated into three categories: matte, matte, and mirror.
6.upkeep switch
The encapsulated GOB's repairability shall guarantee that, in specific circumstances, the encapsulation material can be easily removed and that the removed portion can be filled and fixed during routine maintenance.